£249.50
Signal Processing, Telecommunication & Embedded Systems: AI and ML Applications
Proceedings of Tenth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2025), Volume 3
Overview
This book discusses the latest developments and outlines future trends in the fields of microelectronics, electromagnetics, and telecommunication.
Content and Contributions
It contains original research works presented at the International Conference on Microelectronics, Electromagnetics and Telecommunication (ICMEET 2025), held in London, during October 2025.
Structure and Audience
The book is divided into four volumes, covering papers written by scientists, research scholars, and practitioners from leading universities, engineering colleges, and R&D institutes from all over the world.
Purpose
It shares the latest breakthroughs and promising solutions to the most important issues facing today’s society.
