Overview

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integration packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice.

Major Topics

This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding.

Intended Audience

The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.