3D integration

3D integration is an emerging technology for the design of many-core microprocessors and memory integration.

About the book

Advances in 3D Integrated Circuits and Systems is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.

Contents

Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.

Intended audience

Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.