£115.00
is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits.
Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers.
3D Integration in VLSI Circuits
Design of 3D Integrated Circuits and Systems
Advances In 3d Integrated Circuits And Systems
3D IC Integration and Packaging
Through-Silicon Vias for 3D Integration
3D IC Stacking Technology
Handbook of 3D Integration, Volume 3
Three-dimensional Integrated Circuit Design
3D Nanoelectronic Computer Architecture and Implementation
Three-Dimensional Integrated Circuit Design
From 2D to 3D Photonic Integrated Circuits
Physical Design for 3D Integrated Circuits