The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

• High density through silicon stacking (TSS) technology
• Practical design ecosystem for heterogeneous 3D IC products
• Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
• Process integration for TSV manufacturing
• High-aspect-ratio silicon etch for TSV
• Dielectric deposition for TSV
• Barrier and seed deposition
• Copper electrodeposition for TSV
• Chemical mechanical polishing for TSV applications
• Temporary and permanent bonding
• Assembly and test aspects of TSV technology