3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

£115.95

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Electronics and communications engineering Electronics: circuits and components Computer architecture and logic design

Authors: Lih-Tyng Hwang, Tzyy-Sheng Jason Horng

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Language: English

Published by: Wiley-IEEE Press

Published on: 29th March 2018

Format: LCP-protected ePub

Size: 45 Mb

ISBN: 9781119289661


An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

Features

An interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility

Tools and Examples

Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab

Design Topics

Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail

Teaching Resources

Provides chapter-wise review questions and powerpoint slides as teaching tools

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